半导体市场的供应短缺问题已经进入了第二个年头。为了满足消费者的需求,各大芯片厂商都在不择手段地扩大产能,有的甚至直接放弃了设备测试环节,提前几周接收有可能存在质量问题的光刻机,这一切只是为了尽可能多地生产芯片。
“芯片荒”问题是从2020年下半年开始发酵的。当时为了促进经济复苏,世界各国都出台了一定的经济刺激计划,致使从汽车到游戏机在内的各种产品需求大幅上扬,而所有这些产品都要用到芯片。由于先进芯片的制造工艺十分复杂,所以它的供应弹性相对较小。从零开始新建芯片产能可能需要好几年的时间,而在需求如此不稳定的当下,芯片供给自然是很难跟上需求的变化的。
在此背景下,全球光刻机行业的龙头老大阿斯麦公司(ASML)日前表示,它的很多客户最近已经放弃对芯片设备进行测试,以尽量节省宝贵的时间和金钱——即便这样有可能导致以后出现问题。
1月19日,阿斯麦(ASML Holdings)的首席执行官温彼得(Peter Wennink)在公布年报后表示:“我们的客户迫切渴望额外产能,这是一种前所未有的局面,我以前从未见过这种情况。”
真正“针尖上的舞蹈”:只有几个原子宽的电路图
来自半导体产业协会(Semiconductor Industry Association)的数据显示,当前全球芯片行业的出货量正在迅速增长。2021年前11个月,全球芯片出货量达到1.05万亿个,创下了新的年度纪录(虽然最后一个月的出货量未计算在内)。据半导体产业协会估算,2021年11月,全球半导体行业的总体销售额已经逼近500亿美元大关。
这一数额比2020年11月同比增长了24%,但还远远不足以满足全球快速飙升的芯片需求。比如丰田(Toyota)算是汽车行业里应对芯片短缺做得最好的公司,但是在1月19日,丰田也表示,由于芯片短缺问题,该公司有价值数十亿美元的商品或将无法按计划投产。而在此之前,芯片不足问题已经迫使丰田调整了2月的生产计划。
生产一个芯片要比生产一辆汽车困难得多。芯片所需的生产设施极为繁巨,厂商至少要投入几年的时间和几十亿美元的前期成本。这些晶圆厂的核心设施是操作光刻机的洁净室,光刻机需要在极其苛刻的洁净环境下,进行直径仅为几个原子大小的微电路蚀刻,而整个生产过程需要几周的时间才能够完成。
洁净室里只要混入一粒灰尘,就有可能使晶圆上的几百万个晶体管惨遭报废,因此,工人们必须穿上特制的超净防护服,确保连一根头发丝也不能落在光刻机上。洁净室的温度和湿度也必须保持恒定,甚至空气的流通度也受到严格控制,而且还会被反复过滤和循环。
正是因为芯片的生产过程极为复杂,而且要耗费巨量资本,因此整个芯片行业走的都是外包路线。包括超微半导体(AMD)在内的多家芯片公司都把主要精力放在芯片设计上,而把大部分甚至全部生产环节都外包了给亚洲的晶圆代工厂。
唯一的供应商
一旦政府出台了经济刺激计划,或者出台了减税等利好政策,消费者加大了商品购买力度,这些亚洲的晶圆代工厂的产能就会显得捉襟见肘。为了解决产能问题,像台积电(Taiwan Semiconductor Manufacturing Company)等代工企业最近都在忙着采购新设备。
晶圆代工厂最急需的设备,就是阿斯麦公司的最新产品,比如它的极紫外光刻机。目前,全球仅有阿斯麦的极紫外光刻机能够蚀刻出5纳米制程的晶体管,苹果(Apple)的M1微处理器使用的就是这种5纳米制程的芯片。除了阿斯麦外,全球迄今还没有任何一家公司可以生产如此复杂的设备,美国政府甚至强力干预阿斯麦公司,禁止它将这种光刻机向中国出口。
阿斯麦光刻机的价格一般在几千万美元到几亿美元不等,取决于具体机型。客户通常更愿意在荷兰当地进行测试,设备测试时间一般在两周到一个月左右。测试结束后,才会将设备打包发往目的地。
不过,阿斯麦公司的首席执行官温彼得在近日表示,由于所有客户都忙着扩大产能,他们已经没有了等到做完全套测试的耐心和余裕。
他说:“实际上,我们已经跳过了测试环节,直接把设备运往客户的工厂,这就意味着客户只会进行一次验收测试。这一切都是为了尽量扩大芯片产能。”
虽然芯片行业主要依赖欧洲的光刻机,但在产能方面则要依赖于亚洲,特别是中国台湾地区。
为了弥补这一战略短板,欧盟委员会(European Commission)在1月20日表示,欧盟将于今年2月制定一份新的针对欧盟27国的芯片法案。该法案将包含五大战略支柱,包括放宽原本较为严格的政府补贴规定,其目标是在2030年前,将欧洲占全球芯片产能的份额从10%提高到20%。
欧盟委员会的主席乌尔苏拉·冯德莱恩于1月20日在世界经济论坛(World Economic Forum)上表示:“我们要记住,全球芯片产能(到2030年)将翻一番。”在这样一个快速增长的市场上,要确保提高欧洲芯片所占的比重,“欧洲的产能就至少要在今天的基础上翻两番。”(财富中文网)
译者:朴成奎
半导体市场的供应短缺问题已经进入了第二个年头。为了满足消费者的需求,各大芯片厂商都在不择手段地扩大产能,有的甚至直接放弃了设备测试环节,提前几周接收有可能存在质量问题的光刻机,这一切只是为了尽可能多地生产芯片。
“芯片荒”问题是从2020年下半年开始发酵的。当时为了促进经济复苏,世界各国都出台了一定的经济刺激计划,致使从汽车到游戏机在内的各种产品需求大幅上扬,而所有这些产品都要用到芯片。由于先进芯片的制造工艺十分复杂,所以它的供应弹性相对较小。从零开始新建芯片产能可能需要好几年的时间,而在需求如此不稳定的当下,芯片供给自然是很难跟上需求的变化的。
在此背景下,全球光刻机行业的龙头老大阿斯麦公司(ASML)日前表示,它的很多客户最近已经放弃对芯片设备进行测试,以尽量节省宝贵的时间和金钱——即便这样有可能导致以后出现问题。
1月19日,阿斯麦(ASML Holdings)的首席执行官温彼得(Peter Wennink)在公布年报后表示:“我们的客户迫切渴望额外产能,这是一种前所未有的局面,我以前从未见过这种情况。”
真正“针尖上的舞蹈”:只有几个原子宽的电路图
来自半导体产业协会(Semiconductor Industry Association)的数据显示,当前全球芯片行业的出货量正在迅速增长。2021年前11个月,全球芯片出货量达到1.05万亿个,创下了新的年度纪录(虽然最后一个月的出货量未计算在内)。据半导体产业协会估算,2021年11月,全球半导体行业的总体销售额已经逼近500亿美元大关。
这一数额比2020年11月同比增长了24%,但还远远不足以满足全球快速飙升的芯片需求。比如丰田(Toyota)算是汽车行业里应对芯片短缺做得最好的公司,但是在1月19日,丰田也表示,由于芯片短缺问题,该公司有价值数十亿美元的商品或将无法按计划投产。而在此之前,芯片不足问题已经迫使丰田调整了2月的生产计划。
生产一个芯片要比生产一辆汽车困难得多。芯片所需的生产设施极为繁巨,厂商至少要投入几年的时间和几十亿美元的前期成本。这些晶圆厂的核心设施是操作光刻机的洁净室,光刻机需要在极其苛刻的洁净环境下,进行直径仅为几个原子大小的微电路蚀刻,而整个生产过程需要几周的时间才能够完成。
洁净室里只要混入一粒灰尘,就有可能使晶圆上的几百万个晶体管惨遭报废,因此,工人们必须穿上特制的超净防护服,确保连一根头发丝也不能落在光刻机上。洁净室的温度和湿度也必须保持恒定,甚至空气的流通度也受到严格控制,而且还会被反复过滤和循环。
正是因为芯片的生产过程极为复杂,而且要耗费巨量资本,因此整个芯片行业走的都是外包路线。包括超微半导体(AMD)在内的多家芯片公司都把主要精力放在芯片设计上,而把大部分甚至全部生产环节都外包了给亚洲的晶圆代工厂。
唯一的供应商
一旦政府出台了经济刺激计划,或者出台了减税等利好政策,消费者加大了商品购买力度,这些亚洲的晶圆代工厂的产能就会显得捉襟见肘。为了解决产能问题,像台积电(Taiwan Semiconductor Manufacturing Company)等代工企业最近都在忙着采购新设备。
晶圆代工厂最急需的设备,就是阿斯麦公司的最新产品,比如它的极紫外光刻机。目前,全球仅有阿斯麦的极紫外光刻机能够蚀刻出5纳米制程的晶体管,苹果(Apple)的M1微处理器使用的就是这种5纳米制程的芯片。除了阿斯麦外,全球迄今还没有任何一家公司可以生产如此复杂的设备,美国政府甚至强力干预阿斯麦公司,禁止它将这种光刻机向中国出口。
阿斯麦光刻机的价格一般在几千万美元到几亿美元不等,取决于具体机型。客户通常更愿意在荷兰当地进行测试,设备测试时间一般在两周到一个月左右。测试结束后,才会将设备打包发往目的地。
不过,阿斯麦公司的首席执行官温彼得在近日表示,由于所有客户都忙着扩大产能,他们已经没有了等到做完全套测试的耐心和余裕。
他说:“实际上,我们已经跳过了测试环节,直接把设备运往客户的工厂,这就意味着客户只会进行一次验收测试。这一切都是为了尽量扩大芯片产能。”
虽然芯片行业主要依赖欧洲的光刻机,但在产能方面则要依赖于亚洲,特别是中国台湾地区。
为了弥补这一战略短板,欧盟委员会(European Commission)在1月20日表示,欧盟将于今年2月制定一份新的针对欧盟27国的芯片法案。该法案将包含五大战略支柱,包括放宽原本较为严格的政府补贴规定,其目标是在2030年前,将欧洲占全球芯片产能的份额从10%提高到20%。
欧盟委员会的主席乌尔苏拉·冯德莱恩于1月20日在世界经济论坛(World Economic Forum)上表示:“我们要记住,全球芯片产能(到2030年)将翻一番。”在这样一个快速增长的市场上,要确保提高欧洲芯片所占的比重,“欧洲的产能就至少要在今天的基础上翻两番。”(财富中文网)
译者:朴成奎
Chipmakers are resorting to increasingly desperate measures to keep up with the voracious demand of consumers as the semiconductor crunch enters its second year. That includes foregoing quality assurance tests and taking deliveries of potentially faulty equipment weeks in advance just to squeeze out every last processor they can get.
The seeds of the shortage, now entering its second year, were sown in the latter half of 2020, when a stimulus-fueled recovery worldwide saw consumers snap up everything from passenger cars to Sony PlayStations. Supply of advanced silicon circuits is broadly inflexible due to the complex manufacturing process involved: It can take years to build new capacity from scratch, making it difficult to keep pace when demand is so volatile.
Now the world's leading supplier to the chip industry says its clients are starting to take shortcuts, foregoing the usual barrage of quality assurance tests to which they subject his exorbitantly-priced semiconductor equipment in order to save precious time and money—even if it risks problems arising later.
“Our customers are in bad need of extra capacity,” said Peter Wennink, chief executive of ASML Holdings after reported annual results on January 19. “I think it’s unprecedented. I have never seen this before.”
Only atoms in width
Global sales of chips today are booming, according to the Semiconductor Industry Association. Cumulative shipments through the first 11 months of last year reached 1.05 trillion microchips, already marking a new annual record with one month of sales still left to be tabulated. The total value of semiconductors sold across the world, according to SIA's estimates, came just shy of breaching the $50 billion mark in the month of November.
Even though this already represented a 24% year-on-year increase over November 2020, far more chips are actually needed just to maintain the blistering pace of global growth. On January 19, Toyota, one of the few carmakers that coped best with the shortage, warned billions of dollars worth of merchandise would not be built as planned, after a lack of semiconductors forced it to slash its production plans for February.
Building a microchip is far more difficult than building a Toyota, however. Semiconductors are manufactured in enormous fabrication plants that cost companies billions of dollars in upfront capital and take years to build. At the heart of these "fabs" are clean rooms that employ photolithography machines, which etch miniature circuitry sometimes only a few atoms in width onto silicon wafers in a painstaking process requiring weeks to complete.
Since a single dust particle can destroy millions of transistors on a wafer, workers wear bunny suits that cover their whole body to ensure not so much as a hair lands in ASML's sensitive equipment. Temperature and humidity must be kept constant in a clean room, and even the air descends to the floor in a controlled manner where it is repeatedly filtered and recycled.
The process is so complex and capital intensive that entire swathes of the industry decided to go "fab-less". These chip suppliers, such as Advanced Micro Devices, focus on their expertise in chip design and outsource some if not all of their production to specialist manufacturers called foundries mainly located in Asia.
Sole supplier
When consumers—either flush from stimulus checks or capitalizing on government tax breaks—ramped up their purchases, these Asia foundries were overwhelmed. To address the ensuing crunch, companies such as Taiwan Semiconductor Manufacturing Company (TSMC) have been busy bulking up on new equipment.
At the top of their list are Wennink's latest machines, such as the extreme ultra-violet photolithography systems. ASML is the sole supplier of EUV technology needed to print 5 nanometer transistors like those found in Apple's vaunted M1 processor. No other company in the world has proven capable of mastering the complexity of these devices, and the U.S. government has intervened to ban their export to China.
Since ASML's equipment can typically run in the tens or even hundreds of millions of dollars depending on the machine, customers prefer to run tests in the Netherlands that can last anywhere from two weeks to a full month before these are packed up and delivered to their final destination.
Yet with so much of the economy riding on their every move, Wennink said chipmakers no longer have the patience, desire or luxury to wait for the entire gamut of tests to be performed.
"We actually skip that and we ship the system to the customer’s site, which actually means there is only one acceptance test," he explained. "It’s all about getting wafers out there. More wafer output."
While chipmakers may be dependent on Europe for its photolithography machines, Europe is dependent on Asia for its supply of semiconductors — and Taiwan in particular.
To mitigate this strategic weakness, the European Commission on January 20 said it would unveil a new chips act for the 27-member EU bloc in February. Its five strategic pillars, including loosening otherwise strict rules around government subsidies, is designed to increase the share of chips manufactured in Europe from 10% to 20% of the world’s supply by 2030.
“Keep in mind that the world’s production itself will double (by the end of this decade),” EU Commission President Ursula von der Leyen told the World Economic Forum on January 20. In order to hike its share of the market amid an already growing market then, she said, "this means quadrupling today’s European production.”